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- Available for up to 200mm dia wafers standard, 300mm wafers special order
- 700 to 1200 UPH, application dependent
- Quick change multi-needle eject heads
- Output stage for waffle packs, Gel-Paks, film frames etc.
- Options Include:
- Non Surface Contact die picking
- Die Inverter
- Die Underside Inspection
- High Magnification Die Facet (Edge) Inspection
- Non Surface Contact die picking