DE35-ST Semi-Automatic Die Sorter

    Semi-Automatic Die Handling System

    • Available for up to 200mm dia wafers standard, 300mm wafers special order
    • 700 to 1200 UPH, application dependent
    • Quick change multi-needle eject heads
    • Output stage for waffle packs, Gel-paks, film frames etc.
    • Options Include:
      • Non Surface Contact die picking
      • Die Inverter
      • Die underside inspection
      • High Magnification Die Facet (Edge) Inspection

    Quote Request Form

    Hey there, we appreciate your interest in working with Royce Instruments, you've made some good decisions so far today. We want to make sure we make good decisions too, by properly understanding what your business needs are. Since we are able to customize all of our equipment to our customer's specific needs, the more information you put on this note to us, the stronger our offering will look to you.

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