Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.
Ideal for MEMS and other devices with fragile geometry.
Wafer map capabilities include multi-project wafers and industry standard wafer formats.
AutoPlacer MP300 Die Sorter
DE35-ST Semi-Auto Die Sorter
Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities
• Wire bond pull test
• Ball bond shear test
• Solder ball shear test
• Die bond shear test
• Zone shear test
Royce 650 Universal Bond Tester
Royce 620 Multitest Bond Tester
Royce 610 Dedicated Wire Pull Bond Tester
Learn about how the AP+ can meet your WLP processing needs at IWLPC 2016 in San Jose
Royce Instruments and V-TEK International Introduce New AP+
Visit Royce at IMAPS 2016 in Pasadena to see new AP+
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