Royce Instruments, Excellence in Bond Testers and Die Sorters

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650 Universal Bond tester, Wire Pull Tester, Ball Shear Tester, Die Bond SHear Tester, Solder Ball Pull Tester, Zone Shear Tester

Bond Testing

Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities

Capabilities include:
• Wire bond pull test
• Ball bond shear test
• Solder ball shear test
• Solder ball pull test
• Die bond shear test
• Zone shear test

Bond Testers:
650 Universal Bond Tester
226 Wire Pull Tester

Die Sorting

Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.

Ideal for MEMS and other devices with fragile geometry.
Wafer map capabilities include multi-project wafers and industry standard wafer formats.

Die Sorters:
AutoPlacer MP300 Die Sorter DE35-ST Semi-Auto Die Sorter

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