The new 650 universal microelectronic bond tester cobines wire pull tester, die shear tester up to 200kgf, ball shear tester, solder ball pull tester. The built in PC saves precious clean room bench space and the user friendly motorized microscope stays in focus as it's height is adjusted
Bond Testing
We supply a broad capability to microelectronic chip and wire bond testing. We offer systems for wire pull test, die shear test, ball shear test, solder ball pull test, Stud pull test.

Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities

Capabilities include:
• Wire bond pull tester
• Wire bond ball shear tester
• Solder ball shear tester
• Solder ball pull tester
• Die bond shear tester
• Zone shear tester

Bond Testers:
650 Universal Bond Tester
226 Wire Pull Tester

Bond Test FAQ • Request Additional Information
Die Sorting
Both DE35 and MP300 die sorters can use Non Surface Contact technology for die removal from tape, useful for MEMS, GaAs and other microwave and RF die, pressure sensors and any die with sensitive geometry

Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.

Ideal for MEMS and other devices with fragile geometry.

Wafer map capabilities include multi-project wafers and industry standard wafer formats.

Die Sorters:
AutoPlacer MP300 Die Sorter
DE35-ST Semi-Auto Die Sort

Die Sort FAQ • Request Additional Information
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