Bond Testing
Royce Instruments bond testing systems handle a variety of testing applications.

Capabilities include:
• Wire bond loop pull testing
• Wire bond ball shear testing
• BGA ball shear and pull testing
• Die bond shear testing
• High speed ball shear testing

Bond Testers:
650 Universal Bond Tester
226 Dedicated Wire Pull
Bond Testing FAQRequest Additional Information
Die Handling
Royce Instruments die handling systems range from semi-auto table top systems to automatic high speed 300mm systems with wafer map and ink-dot die selection.

Wafer map capabilities include multi-project wafers (pizza maps) and a range of industry standard wafer formats.

Die Handlers and Sorters:
AutoPlacer MP300
DE35-ST Semi-Automatic
Die Handling FAQRequest Additional Information
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