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Royce Instruments, Excellence in Bond Testers and Die Sorters

650 Universal Bond tester, Wire Pull Tester, Ball Shear Tester, Die Bond SHear Tester, Solder Ball Pull Tester, Zone Shear Tester
 
Bond Testing
 

Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities

Capabilities include:
• Wire bond pull test
• Ball bond shear test
• Solder ball shear test
• Solder ball pull test
• Die bond shear test
• Zone shear test

Bond Testers:
650 Universal Bond Tester
226 Wire Pull Tester

 
 
Die Sorting
 

Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.

Ideal for MEMS and other devices with fragile geometry.
Wafer map capabilities include multi-project wafers and industry standard wafer formats.

Die Sorters:
AutoPlacer MP300 Die Sorter DE35-ST Semi-Auto Die Sorter

 
 
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