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A new automated die sorter to handle the output mediums your process requires (carrier tape, waffle pack, Gel-Pak, JEDEC tray, film frame, grip ring, and custom trays). The AP+ can pick die from wafer, waffle pack, Gel-Pak, JEDEC tray, or custom tray using an input map, perform an optional 180 degree die flip, and place to output, while maintaining input to output traceability at the die level. With its multi-project (pizza map or reticle mask) wafer mapping capability and quick-change fixtures and tooling, this system gives you the highest level of flexibility while maintaining fast change over between processes to support low to medium volume, high mix environments.
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