Royce Instruments provides high quality solutions for your Bond Testing and Die Handling needs.
Royce bond testing systems can handle a variety of testing applications including wire bond loop pull testing, wire bond ball shear testing, BGA ball shear and pull testing, die bond shear testing, and high speed ball shear testing.
Royce Instruments die handling systems range from semi-auto table top systems to automatic high speed 300mm systems with wafer map and ink-dot die selection. Wafer map capabilities include multi-project wafers (pizza maps) and a range of industry standard wafer formats.
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