The DE35-ST Semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Paks®, film frame or directly on substrates.
The DE35-ST eliminates the inefficiencies and down time usually found in small lot production. Simple to learn and use, the DE35i requires no hand tools for die size changeover and setup.
Setup and option information is preserved in non-volatile memory so that, following a weekend shutdown for example, you can restart the machine without further setup.
Waffle pack pockets for die placement are automatically selected. Manual selection using the keyboard arrow keys enables completion of partially filled waffle packs. If a grading output mode is selected, the machine places the die in the next pocket of the corresponding waffle pack and advises the operator when any of the waffle packs are full.
Non-Surface Contact (NSC) Option
Picks die without touching the top surface, ideal for handling die with touch sensitive coatings. Excellent for gripping force under 10g. Picks dies from 0.06 inch square to over 1.0 inch square. Die are gripped by Vespel conductive plastic finger tips. For small die sizes, micro-machined collets are available to suit individual applications.
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