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Royce Instruments®, excellence in Bond Testers and Die Sorters

650 Universal Bond tester, Wire Pull Tester, Ball Shear Tester, Die Bond SHear Tester, Solder Ball Pull Tester, Zone Shear Tester

 
Bond Testing
 

Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities

Capabilities include:
• Wire bond pull test
Ball bond shear test
• Solder ball shear test
• Die bond shear test
• Zone shear test

Bond Testers:
Royce 650 Universal Bond Tester

Royce 620 Multitest Bond Tester

Royce 610 Dedicated Wire Pull Bond Tester

 

 
Die Sorting
 

Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.

Ideal for MEMS and other devices with fragile geometry.
Wafer map capabilities include multi-project wafers and industry standard wafer formats.

Die Sorters:
AutoPlacer MP300 Die Sorter

DE35-ST Semi-Auto Die Sorter

 

 
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