• Available for up to 300mm dia wafers.

• 700 to 1200 UPH, application dependent.

• Quick change multi-needle eject heads.

• Output stage for waffle packs, Gel-paks,
film frames etc.

• Options Include:
Non Surface Contact die picking.
Die Inverter.
Die underside inspection.
Laser Diode high mag facet inspection.
Nomarski phase contrast illumination.