• Available for up to 300mm dia wafers.
• 700 to 1200 UPH, application dependent.
• Quick change multi-needle eject heads.
• Output stage for waffle packs, Gel-paks,
film frames etc.
• Options Include:
Non Surface Contact die picking.
Die underside inspection.
Laser Diode high mag facet inspection.
Nomarski phase contrast illumination.
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