Royce Instruments bond testers handle a wide variety of chip and wire testing applications. Comprehensive SPC and data export capabilities
Capabilities include:
• Wire bond pull test
• Ball bond shear test
• Solder ball shear test
• Solder ball pull test
• Die bond shear test
• Zone shear test
Royce Instruments die sorters range from semi-auto table top systems to automatic pattern recognition 300mm systems with wafer map and ink-dot die selection.
Ideal for MEMS and other devices with fragile geometry.
Wafer map capabilities include multi-project wafers and industry standard wafer formats.
