• Motorized height controlled
microscope that stays in focus
as it moves

• 305mm x 155mm stage for
300mm wafers, leadframes or
substrates

• Ultra Fine Pitch (UFP) capable

• Image Capture Option,
Field Upgradable

• World Language support

• Ribbon Bond testing for
standard to high-power devices

• Die shear up to 200 kgf

• Robust test modules with range
switching, on board calibration
memory, and tool protection