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System 226
Dedicated Wire Pull Tester
 
 
 

• Dedicated wire pull system, for up to 100g.

• Destructive and non-destructive testing
(NDT) of wire bond loops.


• Small footprint.

• Meets MIL Standard 883 and is CE certified.

• Download data to in-house SPC using RS232

 
 
 
The controls of the 226 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 226 easily adjusts to accommodate a broad spectrum of users.

The familiar controls make training quick and easy, minimizing downtime. The standard computer mouse controls the hook height and rotation, along with triggering the test.

A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe. Able to perform both destructive and non-destructive tests, the 226 collects force data against the wire every 10 microseconds.

When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum.

Non-destructive testing is controlled so that the rate of load application exactly meets the user's programmed limit.

Load variance also is programmable by the user prior to testing to provide stricter controls.
 
 
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