Pick-and-Place Upgrade from Royce Instruments Economically Boosts Throughput 20%

NAPA, Calif.—February 3rd, 2004—Royce Instruments, Inc. today announced the availability of an upgrade -- to its DE35 semiautomatic die pick-and-place system --  that economically boosts production throughput of installed systems. Upgraded systems can also be equipped with yield enhancing pick-and-place production capabilities.

“This upgrade, which includes crating and delivery to and from the Royce factory in California, will bring the capability of installed DE35 systems up to same build standard as our current Model DE35i, for about a quarter of the cost of a new system,” said a spokesman.

The factory upgrade replaces all major electronic components, including motherboard, I/Os and motion controllers; services all mechanical parts and replaces them as necessary; and installs the latest firmware and software, all with a one-year warranty for the entire system for shipments within North America.

“The immediate benefits that come with the upgrade include an approximate 20 percent improvement in system throughput to 700-1200 units per hour. In addition, upgrading the DE35 system to DE35i capabilities give users of these systems two additional upgrade possibilities that can be added at the same time or in the future -- motorized die-eject for ultra thin dies and integration of non-surface-contact (NSC) technology,” says a spokesman.

Compared to conventional air-actuated die eject without precise force control, motorized die eject adds precision to controlling the die ejecting needle, thereby lowering the risk of damaging very thin die.

NSC uses die grippers with Vespel® conductive-plastic finger tips to pick a die at its edges, using a gripping force as low as 10 gmf. Users prefer NSC for MEMS and GaAs die or other die with fragile or sensitive surface geometries.

The upgraded DE35 and the DE35i can pick and place die from 0.006 square inches to more than 1 square inch from sawn wafers placing them into a waffle pack, a Gel-Pak® or a film frame.

The availability of this upgrade is rooted in Royce Instrument’s dedication to customer service. “Today, you have to earn a reputation for excellence in after sales support,” says a spokesman. “This economical upgrade, with its inherent production benefits, to a system that has an extensive installed base, is an excellent example of our commitment to customer service. This kind of product service is embedded in our company culture.”

About Royce Instruments, Inc.

Royce Instruments, Inc. designs and manufacturers assembly and bond testing systems used in the photonics and semiconductor manufacturing industries. Its products include equipment for laser diode manufacturing, wire and die bond testing, semiconductor die pick-and-place, and hybrid epoxy die bonding. Royce customers include leading laser and photonics manufacturers, major semiconductor companies, assembly subcontractors, computer manufactures, aerospace companies, and most of the worlds largest automobile, heart pacemaker, and medical electronics device manufacturers. More information is available on the Royce Instruments website http://www.royceinstruments.com/.