| Our Company |
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Royce Instruments, Inc. celebrates 25 years as an innovative global leader for design and manufacture of precision assembly tools and high accuracy, low force bond testing equipment.
Our products include equipment for wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak™ and semi-custom die handling in the life sciences and laser diode industries |
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Royce Instruments’ equipment continues to be utilized throughout the world by the leading semiconductor and photonics manufacturers, assembly subcontractors, computer manufacturers, aerospace companies, and most of the worlds largest auto and medical electronics device manufacturers.
Royce Instruments takes pride in our support of our customers’ requirements. We have worldwide sales and technical presence in over 30 countries, providing the level of service and support our customers come to expect.
As our customers’ technology and product offerings evolve, we are continuing to expand and develop equipment to meet their needs.
With our leadership and knowledge of our ever expanding markets, our mission is to supply high precision mechanical test and assembly product solutions, which exceed our customers’ performance, quality, and service expectations.
We invite you to give us the opportunity to show you why we are the supplier of choice.
Malcolm Cox, CTO |
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About Royce Instruments